Study of Metallurgical Reactions between Copper and Sn2.3Ag Microbumps
碩士 === 國立交通大學 === 材料科學與工程學系 === 99 === Due to the progress of packaging technology, microbumps has been adapted as the interconnect of advanced packaging. When the interconnect is shrinkage into microbump level, reliability become an important issue. In this study, we study the metallurgical reactio...
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| Format: | Others |
| Language: | zh-TW |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/09846055912917859589 |