Interface Morphologies and Electrical Properties of Bonded GaAs Chips to GaAs Wafers
碩士 === 國立交通大學 === 材料科學與工程學系 === 99 === There are some researches about comparing n-GaAs wafers bonding for different contact area of wafers; therefore, this study is mainly about factors affect n-GaAs wafer bonding by observation on the morphology of bonding interface through the use of Transmission...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58314611758376267201 |