| Summary: | 博士 === 國立成功大學 === 製造資訊與系統研究所碩博士班 === 99 === This research aims to develop a remote monitoring and diagnosis architecture for a machining system, by creating a more miniature and intelligent wireless sensors. These concepts are essential when developing a flexible remote monitoring and diagnosis architecture for a machining system. A wireless MEMS (Micro-Electro-Mechanical Systems) Sensors based intelligent diagnostic system is proposed and implemented. Test results verify the feasibility of the architecture.
The concept of 5-Layers for remote monitoring and diagnostic architecture is introduced, including (1) Signal processing layer (2) Data transmission layer (3) Data Fusion layer (4) Performance assessment layer (5)System integration layer. Based on the concept of 5-Layers for remote monitoring and diagnosis architecture, a wireless MEMS sensors based intelligent performance prediction and fault diagnostic system for the CNC spindle is proposed and implemented: the different rotating speeds of the spindle motor produce vibrating signals that are acquired by MEMS Sensors. Features are extracted using the wavelet packet method. The data is then fused using an performance index function method in combination with an artificial neural network. In order to assess the condition of the spindle motor, the features extracted from the acquired signals are input into the training model of the artificial neural network, so output serves as a performance index. The output data can be sent to the SQL server via a rule-based intelligent agent to integrate the remote monitoring and diagnostic systems of the machining system.
A CNC spindle motor commonly featured in machining systems is chosen to verify this architecture. Under the normal and eccentric spindle states, system modeling is built up for a high speed (3,000RPM), medium speed (2,000RPM) and low speed (1,000RPM)
The test results of samples of different rotating speeds under the normal and eccentric spindle states show the effect of the intelligent diagnostic system and verify the feasibility of the architecture in terms of miniaturization, wirelessization and intelligentization.
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