The Analysis of the Thermal Characterization and Fatigue of Package-On-Package (POP) Assembly

The Analysis of the Thermal Characterization and Fatigue of Package-On-Package (POP) Assembly

碩士 === 國立成功大學 === 機械工程學系碩博士班 === 99

Bibliographic Details
Main Authors:	Fu-TingWu, 吳輔庭
Other Authors:	Gien-Huang Wu
Format:	Others
Language:	zh-TW
Published:	2011
Online Access:	http://ndltd.ncl.edu.tw/handle/73660599249985075058

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