Application of Dimensionally Stable Anode for Via Filling Plating

• Main Authors: Mei-Ling Wang, 王美齡
• Other Authors: 竇維平
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/34189191988373736759

碩士 === 國立中興大學 === 化學工程學系所 === 99 === In order to solve these problems caused by soluble anodes, Dimensionally Stable Anode (DSA) was examined as a potential alternative. In this thesis, we analyzed different types of DSAs and developed specific plating additives for DSA. The results show that traditional accelerators, such as Sodium 3-Mercapto-1-Propanesulfonate (MPS) and Bis(3-Sulfopropyl) Disulfide (SPS), commonly used in the plating bath with soluble anodes, could not survive for a long time in the plating bath with DSAs. A specially formulated accelerator was able to stay active for a long time in the DSA system. With a compatible accelerator, the DSA was then used to carry out copper filling of through silicon via (TSV). A new copper plating formula was explored and evaluated for this process. Excellent filling performance could be obtained with this formula when employed simultaneously with the new accelerator and DSA in a plating bath. Afterwards, iridium dioxide and two modified DSAs were used to compare with a phosphorus-containing copper anode. Various DSAs and a new accelerator for TSV filling were evaluated and explored using electrochemical analysis instrument, practical plating, and examining cross-sections.