Improving die bonder production rate and yield by Six Sigma Method
碩士 === 康寧大學 === 生產事業管理研究所 === 99 === A procedure is die bonding is the important process for the die packaging process in the integrated-circuit manufacturing process. . The quality of die bonding processing is closely related to the entire assembly process quality. The device used in die bonding p...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/26199671085514095247 |