Characteristics research of Halogen-Free Solder Mask

• Main Authors: Douglas Lin, 林柏宇
• Other Authors: Tien-Tsorng Shih
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/81065576500879502015

碩士 === 國立高雄應用科技大學 === 電子工程系 === 99 === Environmental awareness, Began in the European Union in 2006, RoHS was made. The halogen-free is the goal of the electronics industry. Greenpeace vigorously promote lead-free and halogen-free manufacturing process, every company have been opened that then declared out of the halogencompound before 2011. Purpose of this experiment is to study on the integrated circuit solder mask process. The halogen-free ink AUS320 and halogen-free material ink AUS308 to compare the current mainstream, how to achieve the optimum conditions. AUS320 has an extensive and stable operating conditions, can get better resolution and imaging capabilities. The halogen-free materials means Chlorine and Bromine content of less than 900ppm, After ion chromatography can be found AUS308 chlorine 291ppm and bromine 235ppm, It’s not really halogen-Free, Through the actual process, first of all be able to tell by SEM on the window at 80μm, The side wall is quite clean with no debris of AUS320. After washing by plasma, the small average roughness of the AUS320 is good and better combination of copper. FTIR measurements using cross-linking reaction to obtain light response rate of 93% and the thermal reaction has reached 95% level.Reliability testing also have to reach the current standards.