The Study of De-flash Process on Exposed Die Paddle Delamination for Quad Flat Non-Leads（QFN）Package

• Main Authors: Chen-Hung Lee, 李錚鴻
• Other Authors: Shi-Shiun Cheng
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/20630379254674882576

碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 99 === This main part of this thesis is concerning with the delamination phenomenon of Quad Flat Non-Leads package (QFN) between molding compound and expose die paddle in IC package assembly factories. The characteristic of QFN Package is the technology of single package process. EMC is on the front of the lead frame and another are the exposure bottom paddle and the terminal. The purpose of this thesis is to check the influence of ED process by tuning the different working parameter. (ex. Voltage and Temperature, Concentration of ED chemical…etc.) For the result, we found the delamination phenomenon occurred whatever we tuned any parameter. And partial flash could be removed, even all flash couldn’t be removed for some condition of experiment. One of test condition, no electric current in ED process, the test result showed that the delamination phenomenon wasn’t found. Therefore we evaluated that ED process is replaced by no Electro De-flash method, Chemical De-flash process to keep the de-flash ability and prevent from the delamination phenomenon. The results were proved that the delamination issue is found after ED process and never found after CD process. And CD process is better than ED process for the delamination issue. That is, CD process used for de-flashing would be an important reference for improving the shortcoming of delamination in industry.