| Summary: | 碩士 === 崑山科技大學 === 光電工程研究所 === 99 === In this paper, this study is divided into three parts. In the first parts, we investigate three phosphor particle sizes for light uniformity effect. Based on the result, the phosphor particle size is greater have better uniformity and high efficiency.
Through the first experiment result extended to the second experiment; In the second parts, we use silicone resin to be mixed with phosphor powder made into a bulk of phosphor, After the phosphor bulk adhesive to chip surface and convention package method for comparison. Based on the result, the phosphor bulk package method and the operating current is 350 mA, the luminous flux is enhanced 16.8% and the uniformity improve by1%, and saturation current is about 820 mA.
Experiment third; the phosphor doped in the silicon, and then coating on the glass by spin coating method to the package and condition package method for comparison. Based on the result, comparing with to tradition process, under the operating current of 350 mA and 700 mA, the novel process could enhance luminous is about 10.5% and 6.3%, respectively. And light uniformity enhance is about 4%. From the above experimental proved that novel process on the light and electrical properties better than tradition packaged.
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