| Summary: | 碩士 === 義守大學 === 電子工程學系碩士在職專班 === 99 === Along with the progress of technologies, the consumer products become lighter, thinner, shorter and smaller. However, the high frequency noise also become more serious at higher operating frequencies. The noise signals are propagated through power lines or by radiation and will affect the normal operations of electrical products. In this thesis, the reflection, cross-talk and electromagnetic interference of signals are detailed introduced in the first part. Then, the design steps of traditional PCB to the advanced high speed PCB with signal integration are presented. The simulation of high speed microstrip line circuits are made by software tools in this thesis. The different terminal connected technologies to reduce the signal reflection are discussed by simulated data and waveforms. The optimum layouts between PCB layers and the terminal connection methods of the key signal lines are obtained by the results of simulation and analysis. The simulated results of layouts are verified by actual circuit boards test and measurements. The verifications of EMI and the strategies to reduce EMI are presented to satisfy the requirements of system design. The actual EMC cases are discussed to analyze the effects of PCB layouts on the EMI of products in this thesis. In the final part of this thesis, the concepts and tests of EMC are discussed to guarantee the normal operations of circuits on the boards and reduce the electromagnetic radiation of the boards and interferences from outside。
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