Deflection Improvement by Connector Size Parameters Modification

• Main Authors: Chih-hao Lee, 李誌浩
• Other Authors: "none"
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/67733286687326300540

碩士 === 逢甲大學 === 材料與製造工程所 === 99 === As rapid development of 3C electronics products, connectors become more important. For tendency of commercial electronics being much lighter, smaller, and thinner, thickness of connector is decreasing and gaps between terminals become shorter. Therefore, precision of connector sizes are significant. In this work, CAE is as design and analyzing tool. It has advantage of shortening products developing time. And it can help control good performance of electronics products. Moreover, it can save cost of testing and modifying molds. Mold flow software Moldex3D is used for numerical analysis. And by Taguchi method, different experiments of combinations of connector size parameters are tested to check performance. Deflection is used as index of performance. A set of optimal parameters for connector injection molding is obtained. And it is proved having good performance and least deflection by experimental results.