Wire Tension Analysis for Wiresaw

• Main Authors: Chia-Cheng Chang, 張家誠
• Other Authors: Nan-jou Lin
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/95390786208502426189

碩士 === 逢甲大學 === 自動控制工程所 === 99 === In the semiconductor and solar energy industries, the wafer production capacity and yield rate are very important. Owing to that wafer nowadays is produced by using muti-wire saw machine to slice silicon ingot, therefore muti-wire saw machine plays an important role in semiconductor and solar energy industries. But the domestic technique of manufacturing muti-wire saw machine is immature, so the main purpose of this thesis is to model cutting wire of muti-wire saw machine, simulate and observe tensile force response of cutting wire in different situations. Then assist the simulated and observed results can provide useful information in design and parameter tuning of muti-wire saw machine, which in turn enhance the wafer production capacity and yield rate. We use SimMechanics to model the muti-wire saw machine. SimMehcanics provides a powerful block diagram modeling environment for simulation of rigid-body machines like wheel and their motions. But there is no native support for flexible dynamics modeling such as axially moving string like cutting wire. This thesis presents an approach to this problem. The extensibility of MATLAB and Simulink allow possibility to create cutting wire model. The integration-in-Simulink feature of SimMechanics enables the link between flexible-body like cutting wire model and rigid-body machine like wheel in a single environment, so that a multi-wire saw machine can be modeled.