Fabrication and Applications of Three-Dimensional Microsolenoid Structures

• Main Authors: Hong-Ze Liu, 劉泓擇
• Other Authors: Chi-Chih Lai
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/86677259657292150324

碩士 === 逢甲大學 === 自動控制工程所 === 99 === Abstract 　　This paper presents a three-dimensional microsolenoid sensing structures. The microstructures are designed with and without a metal Ni-core. Three-dimensional microsolenoid with different size and number of turns are designed. Different structures of three-dimensional microdevices are fabricated based on microelectromechanical system (MEMS) technology to minimize device dimension and to increase production efficiency. Basic operation and theoretical analysis are performed to estimate characteristics of developed structures. This chip size, 10 mm × 10 mm, contains 8 three-dimensional microsolenoids with coil numbers of 30 and 60 turns, and different coil’s width 50, 75 and 100 μm, respectively. A typical top view of an experimented solenoid is 3 mm × 0.15 mm. Developed microsolenoid structure can be applied as an antenna to measure electromagnetic signal. Experimental results show that signal power detection can be promoted form -42.0 dBm to -34.8 dBm. The sensitivity of developed sensors for measuring magnetic intensity is about 0.58 μT/mV.