Application of Eutectic Process to High-Power Light-Emitting Diode Packages
碩士 === 大葉大學 === 電機工程學系 === 99 === In this thesis, the eutectic bonding technology is used in high-power light-emitting diodes (LEDs). After the thin-film process, a layer of Ni-Ag alloy was deposited on the back of the wafer, and then annealed. Finally, the metal bonding technique is used for...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88388742767615013409 |