A Study of a Group of High Power LED Lamp with Single Heat Transfer Mechanism

• Main Authors: Xiang-Chen Haung, 黃向辰
• Other Authors: Cheng-Hsing Hsu
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/00933639705621674024

碩士 === 中原大學 === 機械工程研究所 === 99 === LED has an electric-optic conversion efficiency (electrical to optical conversion efficiency) of 20% to 30%, with the remaining 70% to 80% converted into thermal energy. Therefore, without a well-arranged heat dissipation mechanism, the operating temperature will be too high, thus shortening the life-span of LED. 　　In this study, the thermal module of simulating high power LED with CFD (Computational Fluid Dynamics) software ICEPAK is applied. The experiment data and simulation value/numerical simulation are compared to establish the basic parameter of its numerical simulation, thereby changing the boundary condition of the heat pipe and fan of the thermal module and analyzing the temperature of LED and heat sink. 　　In conclusion, the research results showed that the temperature error of fin is within 2%, whereas LED has a temperature error of no more than 1.3%. The results also showed that multiple LED can be connected by using heat pipes and dissipated with single thermal modules. Moreover, the temperature of LED can be effectively reduced by the mutual use of heat pipes and fans. In regards to the number of LED sets, the thermal results showed that by adding a set of LED, the average temperature of the whole LED is increased by 1.02 times.