Evaluation the Mechanical Reliability of the Sn-3Ag-0.5Cu-8In-1Zn on OSP substrate
碩士 === 中華大學 === 機械工程學系碩士班 === 99 === Abstract The mechanical properties of organic solder ability preservatives (OSP) Cu substrate with a Sn-3Ag-0.5Cu-8In-1Zn Pb-free solder have been studied. For comparison, a Au/Ni-p/Cu substrate was also tested. Experimental results showed that the average shea...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02220715308109598648 |