Single-Layer RDL Routing in Flip-Chip Designs

• Main Authors: Lu, Kai-Ping, 呂凱平
• Other Authors: Yan, Jin-Tai
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/31368557770680776974

碩士 === 中華大學 === 資訊工程學系碩士班 === 99 === Due to complication of modern IC designs, the requirement of IO count in a chip is growing continuously. Flip-chip technology has been used between IC designs and package. Because of high IO count in flip-chip technology, it makes the IOs in a complicated chip connected and the availability of IO connections improved. For RDL routing, it is lack of the results of pre-assignment in Area I/O RDL routing. In this thesis, we propose a two-phase approach to complete the RDL routing. In first phase, a given set of IO connections between IO buffers and bump balls are assigned by using routability-driven partitioning-based IO assignment. In the second phase, the RDL routing process is implemented by using the technology of net renumbering and maximal net sequence. The experimental results show that our approach can achieve 100% routability. Compared with the pre-assignment RDL router[13], our proposed approach saves 3.7% of total wirelength and 27% of CPU time for the tested examples on the average.