Single-Layer RDL Routing in Flip-Chip Designs
碩士 === 中華大學 === 資訊工程學系碩士班 === 99 === Due to complication of modern IC designs, the requirement of IO count in a chip is growing continuously. Flip-chip technology has been used between IC designs and package. Because of high IO count in flip-chip technology, it makes the IOs in a complicated chip...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31368557770680776974 |