| Summary: | 碩士 === 長庚大學 === 化工與材料工程學系 === 99 === Smart phones are getting lighter, thinner and smaller, and the trend will initiate a new set of requirements for the antenna; therefore, the antenna design has been highlighted with a great importance that the antenna should be embedded inside a smart phone. Also, the film antenna, which can decrease the side of an antenna, is going to be another trend in design.
At the moment, the antenna design mainly lies on the embedded antennae techniques; namely, there are Hot Melting, Flexible PCB and Laser Direct Structuring (LDS). The new technique, LDS, is to construct an antenna on the mobile phone case. Compared with traditional antennae, the LSD antenna is more complex and more expensive.
Based on two metallic-thin-film manufacturing processes-LDS and Sputtering, this study is to explore the distinct features of the manufacturing process with the metallic thin film in three different thicknesses. Firstly, deposit metallic copper in three different degree thicknesses and use them as the materials of the antenna electric conductive circuit. Secondly, deposit three kinds of metallic nickel with the same thickness and use them prevent the metallic copper from oxidizing so as to make the substrate become an electrical conductive thin-film antenna. To compare the values of the antennae produced in different manufacturing processes, each antenna will be used to measure its Return-Loss value. The smaller the Return-Loss value is, the better the antenna will be.
In virtue of the easy control of the film thickness of Sputtering and its highly well-mixed and mass-production feature, the cost saving purpose can be reached by the advantage of decreasing the film thickness and raising the production yield.
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