Simulation of Substrate Crack Propagation in a Thin Film/Substrate System Subjected to Uniform Stress

• Main Authors: Pey-Chiann Tsai, 蔡佩蒨
• Other Authors: N. Yu
• Format: Others
• Language: en_US
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/12420041091909391124

碩士 === 元智大學 === 機械工程學系 === 98 === The extended finite element method (XFEM) is able to analyze the problems, for example, discontinuities and singularities that standard FEM cannot efficiently solve. XFEM allows modeling a crack without explicitly defining the crack surface and needs no remeshing when a crack propagates. In the present work, an XFEM code for crack growth problems is developed. An edge crack in a plate subjected to axial loading is firstly considered. An inclined crack in a plate and an edge crack in a double cantilevered beam are studied subsequently. The results of XFEM are compared with the analytic estimates provided by fracture mechanics. The crack near the interface between a substrate and film subjected a uniform stress is then considered. Some important effects, for example, material mismatch and the depth of the substrate, are studied. The results are benchmarked with reported theoretical predictions. The depth of steady-state will be changes by different film/substrate system. It is not depended on the crack position of initial.