The study of the influence of the uniform temperature in IR reflow on tin paste solidification
碩士 === 元智大學 === 機械工程學系 === 98 === There are numerous of solder joints in electronic elements, in which solder joints is greatly attributed to the most impaired part causing dysfunction of the whole electronic components easily.In other words, if there is any solder joints defective will impede or br...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/51661652995115750105 |