Development of a Mechanical Test Machine to Simulate the Thermal Cycling Reliability Test for Electronic Components
碩士 === 元智大學 === 機械工程學系 === 98 === The accelerated thermal cycle(ATC) test was probably one of the most important tests among the electronic reliability tests. It is time consuming and always causes a bottleneck in the lab loadings. Therefore, the mechanical bend and shear tests were often used as a...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/95132150976976428627 |