Comparative Study between Sn37Pb and Sn3Ag0.5Cu Soldering with Au/Pd/Ni(P) Tri-layer Structure
碩士 === 元智大學 === 化學工程與材料科學學系 === 98 === A procedure in soldering reactions between Au/Pd/Ni(P) (0.1/0.2/7, microns) tri-layer structure and two kinds of solders (Sn37Pb and Sn3Ag0.5Cu) were investigated in this study. In Sn37Pb soldering system, it was found that Au layer could disappear within 5 s,...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71774842205903728645 |