Photoelasticity for stress measurement based on digital image processing

• Main Authors: Hung-chun Wang, 王鴻鈞
• Other Authors: Hsien-Huang Wu
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/10253273316897359097

碩士 === 雲林科技大學 === 通訊工程研究所碩士班 === 98 === The most precise way to measure the stress state or variation of a object by force is by experiment. The photoelastie stress analysis is a technology with a long development and many papers. It uses not only in 2D stress analysis but also with a powerful function in 3D analysis. It could be very fast and accurate in analysis of the stress of a subject if it operates automatically. It is usually done by using information from isoclinic and isochromatic patterns. The isoclinic gives the information of their principal stress directions and the isochromatic the infomation of differences of the principle stresses. Photoelastic stress analysis can be a long and tedious process. With the arrival of powerful personal computers and the digital image process, automated photoelastic analysis is becoming more feasible. However recent and current developments in the field of automated and computer aided photoelastic analysis mean that it is becoming possible to do more complex analysis and to perform it more quickly. This article focused mainly on the development of a set of software and hardware tools which can quickly get the effect of stress distribution. In this study, we used NI (National Instruments) LabVIEW Platforms integrating IMAQ Vision Library and digital image processing to create a measuring system for photoelastic stress analysis. Using this system, we will be able to see the stress distribution and calculate the birefringence coefficient in short time. Finally, we conducted the comparison and verification of related system with PA-100 (L) system produced by Japan Photonic Lattice, Inc.