Thermal Simulation and Analysis of LED Ceramic Substrate

• Main Authors: Po-Chun Lin, 林柏君
• Other Authors: Sea-Fue Wang
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/qy3cgk

碩士 === 國立臺北科技大學 === 材料及資源工程系研究所 === 98 === In this time, LED lighting is gradually replace traditional lighting, either indoor or outdoor lighting,are all to development of high power LED. The cooling capacity requirements of LED is higher and higher, and increasing more stringent. This document simulate the ceramic substrate that we use for high-power LED, with the finite element method software ANSYS Workbench. We simulate steady-state thermal simulation with ceramic substrate .And find the thermal properties of it. The ceramic substrate with three common types, namely, Al2O3, Si, AlN, and two different coating Al, Cu and a high thermal conductivity of diamond films, under different substrate and coating materials and coating thickness chang. We record thermal conductivity and other thermal properties change. Compare the temperature by simulation and the actual measure temperature that measured by infrared measurements, to verify the simulation value is correct or not. This document is for shorten the time of design substrate products in the future.After the simulation and analysis, we can order the following conclusions: 1. Coating thickness is proportional to the substrate’s thermal conductivity. When the Coating thickness increase, it also increase the Horizontal heat transfer on the film. It can makes the heat spread to the edge smoothly, and lower the temperature of the central heat source. 2. When coating thickness increase, it allow the overall thermal conductivity of the substrate close to the film’s thermal conductivity. But when the overall thermal conductivity arrive the maximum, additional coating thickness will increase thermal resistance. 3. Difference between temperature that measured by infrared measurement and the the simulated temperature is about minimum 0.061℃ on the central of the substrate and the maximum 1.5℃ on the edge.