| Summary: | 碩士 === 國立臺北科技大學 === 製造科技研究所 === 98 === Cold plate is a key component of the liquid cooling system. Because cold plate contacts processing chip, its heat transfer and sealing ability is highly required. During the development of cold plate, its machining techniques have been limited so the performance and reliability of the product can not been improved.
This research mainly focused on cold plate’s inner channel design and sealing process. In this research there are three different combinations of fins’ shapes that would be used to design three channels. The three channels are Copper Pillar, Folding Fin and Copper Ball. The comparison of heat transfer and flow analysis among these three channels was conducted by simulation software ICEPAK. During the manufacturing process of cold plate, its upper, lower metal pieces and inner channel fins can be assembled by using the characteristics of its solid diffusion bonding.
The research result showed that the bonding surfaces form the new grain that through the base metal and there is no obvious grain boundary and it reached very tight bonding results. The performance testing showed that Copper Pillar inner channel had the best heat transfer ability .The secondary is Copper Ball inner channel. However, the Folding Fin channel is the last one. From the cold plate pressure drop tests, pressure drop of Copper Pillar inner channel is the fewest, next is Copper Ball inner channel, and the last is Folding Fin channel.
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