A Study of Application Mold Flow Analysis in IMD Process for Complex Surface

• Main Authors: Tsong-Yen Wu, 吳宗彥
• Other Authors: Hsinn-Jyh Tzeng
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/52293699191124665943

碩士 === 南台科技大學 === 機械工程系 === 98 === In-Mold Decoration (IMD) is a new plastic decoration technology, which has the advantage of reducing the product follow-up decoration procedures, such as spray painting、electroplating、sculpture lining,…etc.. Formerly the IMD decoration had been widespread applied to products with regular and surface curvature. Until recently the problems of decoration film fixed position and film wrinkling due to curved surface have been overcome, the IMD technology makes treating the complex surface possible. Moreover, the common and usual defects during the IMD process are warpage defect created by not uniform cooling, and film scour and shear stress problem due to plastic material filling process. The purpose of this study is to utilize the CAE mold flow analysis to solve forming problems of complex surfaces in the IMD process. In addition, the Taguchi method was used to evaluate the warpage problem and shear stress problem in order to maximize the process parameters. The testing results indicate that packing phase number、plastic temperature and packing pressure are the main factors affecting the warpage/deformation, plastic temperature、injection time and mold temperature are key process factors influencing shear stress.