| Summary: | 碩士 === 亞東技術學院 === 資訊與通訊工程研究所 === 99 === ABSTRACT
With the embedded development platform work in increasing the frequency, therefore high-speed circuit demand an increasingly important, and signal transmission in high-speed circuits due to signal integrity (SI) and Electromagnetic Inference (EMI) confronted with very important issue, and these problems will lead to system errors. This article designed to meet the high-speed printed circuit embedded development platform for the purpose of doing signal integrity (SI) simulation for placement and layout design, EMI checking for layout improved design. This embedded development platform equipped with Altera Cyclone III EP3C40F780 chip and Micron MT47H32M16HR of 512MB DDR2 chips, using Cadence Allegro PCB Design 16.3 layout software and Cadence Allegro PCB SI 16.3 SI software, signal simulation is based on Altera and Micron's IBIS Models support the simulation parameters, and then through the NEC EMIStream tool checking EMI specifications, to enhance the layout design specifications, to improve for high-speed PCB design signal integrity and EMI important research basis.
Keywords: Signal integrity, EMI
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