| Summary: | 碩士 === 國立高雄大學 === 電機工程學系碩士班 === 98 === Liquid encapsulant is used to protect gold wires and chips to avoid ambient effects such as particles or moisture. It also provides good reliability results in the mini-projector chips encapsulation process. However, it easily causes the delamination due to CTE mismatch after temperature cycling test and induces package functional failure. This thesis is to study the encapsulation process by different metal frames and encapsulant materials to solve CTE mismatch between the substrate, the metal frame and the liquid encapsulant experiment. At the same time, the stress simulation was demostrated to analyze the stress distribution and the experimental results were verified. From the study, several conclusions are obtained: (1) New liquid encapsulant can be used to solve CTE mismatch and pass O/S test after TCT testing. (2) By warpage measurements and the stress simulation, the overall warpage is improved with new liquid encapsulant.
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