Study of Optimum Encapsulation for Mini-Projector

碩士 === 國立高雄大學 === 電機工程學系碩士班 === 98 === Liquid encapsulant is used to protect gold wires and chips to avoid ambient effects such as particles or moisture. It also provides good reliability results in the mini-projector chips encapsulation process. However, it easily causes the delamination due to CTE...

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Bibliographic Details
Main Authors: Shun-Yen Ku, 古順延
Other Authors: Hsin-Hui Kuo
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/56260262646149457343