Study of Optimum Encapsulation for Mini-Projector
碩士 === 國立高雄大學 === 電機工程學系碩士班 === 98 === Liquid encapsulant is used to protect gold wires and chips to avoid ambient effects such as particles or moisture. It also provides good reliability results in the mini-projector chips encapsulation process. However, it easily causes the delamination due to CTE...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2010
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Online Access: | http://ndltd.ncl.edu.tw/handle/56260262646149457343 |