Noise Suppression Methods by Eliminating Transfer Path on Advanced PCB with SiP Module

• Main Authors: Chung-Hsiang Huang, 黃俊翔
• Other Authors: Tzong-Lin Wu
• Format: Others
• Language: en_US
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/36880391154458782204

碩士 === 國立臺灣大學 === 電信工程學研究所 === 98 === Three noise suppression methods are presented to eliminate three different types of noise in advanced printed circuit board (PCB) with System-in-Package (SiP) module. The first one is the conformal shielding technique. A measurement setup and test vehicles are proposed to systematically evaluate the shielding effectiveness of the conformal shielding technique. The experiment setup using the Giga-hertz transverse electromagnetic (GTEM) cell is proposed for providing low noise floor and high sensitivity for measuring very small radiation. Based on the proposed procedures, 1 μm sputtering copper coating on the test vehicle is manufactured and has about 36-50 dB of shielding effectiveness from 1GHz to 6 GHz. For coupling noises between parallel ground planes is the second kind of noise. A ground via method is proposed to provide broad stopband to suppress this type noise. The ground via method is to put vias periodically to connect ground planes. An analytical solution is derived to estimate the bandgap for using the ground via method, and it can be used to design for arbitrary interested stopband. Emission suppression and coupling noise isolation by using ground via method is presented. The ground bounce noise (GBN) between power and ground planes is the third kind of noise, an embedded planar EBG structure is proposed to suppress this type noise. The embedded planar EBG is embedding planar type EBG structure between ground planes and periodically putting ground vias that connect to ground planes, and it can be applied to multi-layer PCB or SiP modules power planes. An efficient 2D theory is proposed to accurately estimate the 1st bandgap of the planar type EBG structures, and extend to predict the 1st bandgap of embedded planar type EBG structures. The equivalent problems are proposed to simplify the calculating procedures for the 1st bandgap. The embedded planar EBG structures are fabricated on FR4 to demonstrate the excellent performance of power noise and coupling noise isolation.