High-Frequency Electrical Characterization and Equalizer Design for Through Silicon Vias
碩士 === 國立臺灣大學 === 電信工程學研究所 === 98 === In the pursuit of the miniaturization and multifunction, the integrated systems on one packaging has become a trend nowadays in the advanced packaging technologies of semiconductor industry. Among them, 3D IC packaging is one of the main structures which stacks...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/dj729c |