Study of massive spalling in high-Pb/Cu and high-Pb/Ni soldering reactions

博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 98 === Soldering reactions of the high-Pb/Cu at 350°C and the high-Pb/Ni at 400°C were investigated to uncover the massive spalling phenomenon, which was frequently observed in solder joint systems. As a function of solder compositions (99.5Pb0.5Sn, 99Pb1Sn, 97Pb3Sn...

Full description

Bibliographic Details
Main Authors: Meng-Hong Tsai, 蔡孟宏
Other Authors: C. Robert Kao
Format: Others
Language:en_US
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/53907135858390110375