Study of UBM Consumption in Flip Chip Solder Joints with Local Temperature Control
碩士 === 臺灣大學 === 材料科學與工程學研究所 === 98 === With the requirement for decreasing packaging size and increasing quantity for interconnect efficient, flip chip package has become a predominant technology for CPU and GPU…The miniaturization of bump pitch always accompany the rise of interconnect current dens...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/81318046475094316762 |