Recovery of Silicon Powder from Kerf-Loss Slurry
博士 === 臺灣大學 === 化學工程學研究所 === 98 === The wire-saw process, in which the materials involved are silicon ingot, stainless wire, abrasive slurry containing silicon carbide particles and polyethylene glycol solution, is used to slice the silicon ingot into wafers for solar cell use. After the sawing stag...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2010
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Online Access: | http://ndltd.ncl.edu.tw/handle/97593548179460171136 |