Recovery of Silicon Powder from Kerf-Loss Slurry

博士 === 臺灣大學 === 化學工程學研究所 === 98 === The wire-saw process, in which the materials involved are silicon ingot, stainless wire, abrasive slurry containing silicon carbide particles and polyethylene glycol solution, is used to slice the silicon ingot into wafers for solar cell use. After the sawing stag...

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Bibliographic Details
Main Authors: Yen-Chih Lin, 林彥志
Other Authors: Yi-Der Tai
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/97593548179460171136