Reliability Analysis of Through Silicon Via (TSV) Structure and Copper Trace of 3D Chip Stacking Packaging
碩士 === 國立清華大學 === 動力機械工程學系 === 98
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/71921143839624519924 |