Lead Free Bump Assembly Material and Structure Study for 40 nm Wafer Technology
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 98 === Solder bump is used to connect organic substrate with chip to form Flip Chip package. Comparing to wire bond package, the path is reduced so the electrical performance is much better. Due to the environmental concern, eutectic bump is replaced by lead-free...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94066162279246754576 |