A novel package technical for high power InGaN LED based on Si bench and Cu plating technologies
碩士 === 國立中山大學 === 光電工程學系研究所 === 98 === A high efficient packaging technique was proposed for power InGaN light emitting diodes( LEDs ).In this approach , sub-mounts based on Si bench technology were used to provide a fact heat conducting channel between the LEDs and the cases.Two different structu...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98176367912697663125 |