| Summary: | 碩士 === 國立屏東科技大學 === 材料工程所 === 98 === To keep pace up with the trend in the miniaturization of electronic components, focused effort has been put in forced on the development of small multilayer ceramic capacitors (MLCC) to meet the rapid development of integrated circuit and surface mounting technology. In order to confront the requests on smaller size, higher performance and lower cost, the manufacturing techniques of the MLCC have closely engaged the development of base metal electrode (BME) and thinner dielectric ceramic layers. Therefore, the improvements will be focused on: (1) reducing the metal within the electrode layer and the effective dielectric thickness; (2) development of high-k dielectric material. In this study, the nickel paste with Cu or TiO2 dopant as internal electrodes were performed on MLCC based on (Ba0.96Ca0.04)(Ti0.85Zr0.15)O3 ceramic (BCTZ) with Copper end-termination. A green sheet was prepared by tape casting using the BCTZ powders. Cu or TiO2 doped Ni paste was attached on the green sheet as an internal electrode. After lamination, the green chips were binder-burn-out at 300 °C for several hours, then samples were sintered at 1220 °C for 2 h in reducing atmosphere. To improve the Ni electrode continuity during sintering, the nickel paste with different amounts of copper, e.g., 1 wt.%, 2 wt.%, 3 wt.% and 10 wt.%, was added in this study. The electrical properties and microstructures of the MLCCs were investigated subsequently. The results showed that Ni paste with Cu dopant has good performances on the dielectric constant and electrode continuity of MLCC, but the dielectric loss (tand) is a little bit higher compared to standard MLCC. On other hand, the nickel paste with different amounts of TiO2 was also added in this study. The electrical properties and microstructures of the MLCCs were investigated subsequently.
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