| Summary: | 碩士 === 國立東華大學 === 材料科學與工程學系 === 98 === Formerly the copper micro ∕ nano structures were almost zero dimensional particles that prepared by chemical solution method or others, but the researching and studying of growth mechanism about one dimensional to three dimensional structures were lacking. Hence, In this study the self-assembly copper dendrite structures were reduced around indium tin oxide glass by chemical solution method, the different morphologys of copper dendrite were controlled with solution concentration, reaction temperature, and quantity of pasting metal island. In this research, the substrate was by indium tin oxide glass that pasted metal islands as zinc, copper, indium, and rail which provided the source of reduction electrons, then to be reduction oxidation by set in CuCl2 solution which solvent was ethylene glycol. The great quantity of copper dendrite structures were reduced around the substrate or on metal island when reduction parameters were reaction temperature 70～130 ℃, quantity of pasting metal island 2～4, and solution concentration 1000～10000 ppm, the growth mechanism of copper dendrites were reasoned by controlling reaction time, then the properties and reduction size were analysis by XRD、TEM、FE－SEM、UV－Visible.
By the results of experiment, the structures of copper dendrite were polycrystals that absorption wavelength located 750～770 nm, and the copper belts which aspect ratios were about 11.274～13.050 that grew on side with temperature 110～130 ℃；the average size of copper particle was be shrink tendency that from 3.8 um to 130 nm by adding the quantity of pasting metal island. The cube, polyhedron, flake, and stick structures etc. were reduced by pasting different categorys of metal island.
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