Temperature Control for a Thermosonic Flip Chip Bonding Stage
碩士 === 國立彰化師範大學 === 機電工程學系 === 98 === In this thesis, the experiment study of heating table for thermosonic flip-chip bonding is presented. Improving the efficiency of heating table plays an important role in the bonding process.However, the heated temperature of the plate is a key factor that affec...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38878256622070962908 |