Measurement of thermal resistance of LED package with infrared at Steady state

• Main Authors: Jing-sian Chen, 陳憬憲
• Other Authors: Ching-Cherng Sun
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/28706452906955256954

碩士 === 國立中央大學 === 光電科學研究所 === 98 === In this thesis, we used a high power infrared light source to emulate the heat source and built a novel system for thermal resistance measurement. In this system, a thermal camera is used to measure the temperature distribution. With the temperature distribution over the entire sample measured, we can obtain the thermal resistance of the test sample. All commercially available high power LED packages’ thermal resistances were measured based on the system that we constructed. The measurement results were compared with theoretical models which base on the finite element analysis method. Contact thermal resistance can also be estimated by comparing the experimental measurement results with the FEA simulation results. A brief discussion was provided about the contact thermal resistance contributed by different bonding methods which using different bonding material based on the analysis developed.