The FEM analysis and verification of reliability in assembly engineer of automobile IC–Case study of MCP delamination
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 98 === To fulfill the requirements for high quality, high structure and multi-function in Automobile industry, thus the IC with multi-function in multi-chips package structure is becoming the mainstream in Automobile application. By Multi Chip Package (MC...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/48729548279687531348 |