| Summary: | 碩士 === 國立交通大學 === 工學院碩士在職專班精密與自動化工程組 === 98 === Technology advancement, IC chip need to own the features of light weight, ultra thin, short, small and high performance, huge memory capacity as well. To achieve huge capacity, chip need to be ground to 75μm, some are even need to reach 25μm before die stacking.
Si chip are still mounted on the dicing tape after cutting and which requires die bonder to eject the chip. During the ejection process, thin Si chip are easily to crack by the contacting method and casus discard. In IC assembly, Die Bonder ejection process is the key point of through- put.
The thesis use ANSYS to research on the damage during thin chip ejection process. In the meantime, select Taguchi experiment to carry on contrast to figure out the best design of ejection pin arrangement and recipe. Consequently, reduce the die crack and improve through- put from 60% to 95.31%.Believe this research would be helpful on related production and process analysis.
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