| Summary: | 碩士 === 國立成功大學 === 機械工程學系碩博士班 === 98 === From the perspectives of capabilities and manufacturing costs, a lot of structures and assembled using distinct materials. Under either thermal or mechanical stresses during fabrication or in-use conditions, debonding is likely to occur on the interface of materials. The conventional approach for studying the interface crack growth and related failure is by suing experimental tests to obtain empirical estimations. The required cost is high and the time duration is lengthy. To overcome this difficulty, the cohesive zone model (CZM) approach may be used to study the interface crack problem.
In this study, finite element analysis using a bilinear CZM is used to simulate interface debonding under either thermal or mechanical loads. The model is applied to study the interface crack formation and growth from bimaterial wedge corner under bending loads. The effect of corner wedge angle on crack growth rate is also investigated. The modeling results agree to those typical fracture mechanics approach.
In addition, as an interface to reduce the complexity of finite element model, global-and-local finite element approaches were also examined. The global-and local model with coupled displacement condition is shown to the same results as that obtained from the single model.
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