A Dual-Mode AC Signal Processing IC for Bio-Sample Detection

碩士 === 國立成功大學 === 電機工程學系碩博士班 === 98 === With the improvement of sanitation, the invention of vaccines, the innovation of medical technology, and the progress in health care systems, the incidence of disease is significantly decreased, the cure rate is also increased and the average life of human...

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Bibliographic Details
Main Authors: Tse-AnChen, 陳則安
Other Authors: Chia-Ling Wei
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/40611188309951510635
Description
Summary:碩士 === 國立成功大學 === 電機工程學系碩博士班 === 98 === With the improvement of sanitation, the invention of vaccines, the innovation of medical technology, and the progress in health care systems, the incidence of disease is significantly decreased, the cure rate is also increased and the average life of human being has been prolonged significantly. Therefore, the biomedical detection can early detect the disease and even prevent disease gets more and more attention. In recent years, integrating biomedical detection technology into chips is one of the main trends in IC design field. By integrating the circuits, people can perform their basic bio-detections at home, with no need to go to hospital. The presented chip uses the electrochemical impedance spectroscopy (EIS) method. Compared with other bio-sample detection methods, this detection method is much faster, and both the input signals and measured signals are all electro signals, so it can be directly and effectively integrated the circuit into the system chip. This chip contains the entire front-end input signal processing circuit and sensing circuits of the bio-sample detection system. The input signal processing circuits can provide two sets of identical constant voltage or constant current AC signals. Its frequency range is from 10 Hz to 10 kHz, its output voltage range is 1.5V~3.5V, and the maximum magnitude of its output current is 1mA. Besides, the sensing circuits detect the magnitude and phase of the measured signals, and convert them into DC outputs. The die area of this chip is 1.7x2.0mm^2 , and the package is 40 S/B. The chip was implemented by Taiwan Semiconductor Manufacturing Company (TSMC) 0.35μm 2P4M 5V mixed-signal polycide process, patronized by National Chip Implementation Center (CIC).