Development of ultra capacitance ESD suppressor for HDMI application

碩士 === 國立成功大學 === 電機工程學系碩博士班 === 98 === Ultra-Capacitance Surge suppression protection component, primarily used in high-speed I / O ports, USB2.0/3.0, HDMI, IEEE1394, DVI and other electronic products protection, and transient over-voltage stress and electrostatic discharge (ESD) of Integrated Circ...

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Main Authors: Chih-ShunLiu, 劉誌順
Other Authors: Cheng-Liang Huang
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/20719190817762194041
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spelling ndltd-TW-098NCKU54420262015-10-13T18:26:16Z http://ndltd.ncl.edu.tw/handle/20719190817762194041 Development of ultra capacitance ESD suppressor for HDMI application 低電容突波抑制保護元件製作及特性之研究 Chih-ShunLiu 劉誌順 碩士 國立成功大學 電機工程學系碩博士班 98 Ultra-Capacitance Surge suppression protection component, primarily used in high-speed I / O ports, USB2.0/3.0, HDMI, IEEE1394, DVI and other electronic products protection, and transient over-voltage stress and electrostatic discharge (ESD) of Integrated Circuits and electronic components or system damage. For advanced VLSI and electronic circuit protection products, the main trends in the search for low-voltage and low capacitance protection components, to achieve effective protection of components and with the high-speed data transmission needs. This paper presents conductive polymer molecular materials with insulating powder, mixed into the deployment of surge suppressors for low capacitance of paste, while the component design concept is based on the field of passive components, manufacturing process to make the basic theory to design the protective components, the main use of the existing ceramic substrate for the component body structure design, screen design in the body through the structure of the gap at the top of the printing layer of a different conductors, and then to learning to know the printing process technologies approach the low capacitance of the surge suppressor paste cover the gap in the two conductors, and by the resistance of plastic burning process technology, the temperature of sintering parts made of electrostatic protection element, and this protection through the external ESD components in bombardment tests, measurement of capacitance electrostatic discharge after bombardment, Trigger voltage and leakage current data, and the volume measured by the results of future discussion of the layout of this different style of work in the same area, different clearance, solid content and temperature than the next, for the attainment of performance components, a low capacitance ESD protection devices with low breakdown voltage requirements and to chip-based protection devices can be designed to integrate with the advanced Integrated Circuits or used independent of the electrostatic protection element in the system. Based on the test results, this thesis production of low capacitance, surge suppression components can indeed consistent with low-capacitance low-voltage surge suppression characteristics of the demand components and applications. At the same time in this study, we measured by DSC thermal analysis system for testing of components than the Trigger voltage and temperature and the gap changes, The best design can clearly understand each element together with knowledge of parameter adjustment can help ESD bombardment test mechanism analysis and carry out structural components. Cheng-Liang Huang Cheng-Liang Huang 黃 正 亮 李文熙 2010 學位論文 ; thesis 64 zh-TW
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language zh-TW
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description 碩士 === 國立成功大學 === 電機工程學系碩博士班 === 98 === Ultra-Capacitance Surge suppression protection component, primarily used in high-speed I / O ports, USB2.0/3.0, HDMI, IEEE1394, DVI and other electronic products protection, and transient over-voltage stress and electrostatic discharge (ESD) of Integrated Circuits and electronic components or system damage. For advanced VLSI and electronic circuit protection products, the main trends in the search for low-voltage and low capacitance protection components, to achieve effective protection of components and with the high-speed data transmission needs. This paper presents conductive polymer molecular materials with insulating powder, mixed into the deployment of surge suppressors for low capacitance of paste, while the component design concept is based on the field of passive components, manufacturing process to make the basic theory to design the protective components, the main use of the existing ceramic substrate for the component body structure design, screen design in the body through the structure of the gap at the top of the printing layer of a different conductors, and then to learning to know the printing process technologies approach the low capacitance of the surge suppressor paste cover the gap in the two conductors, and by the resistance of plastic burning process technology, the temperature of sintering parts made of electrostatic protection element, and this protection through the external ESD components in bombardment tests, measurement of capacitance electrostatic discharge after bombardment, Trigger voltage and leakage current data, and the volume measured by the results of future discussion of the layout of this different style of work in the same area, different clearance, solid content and temperature than the next, for the attainment of performance components, a low capacitance ESD protection devices with low breakdown voltage requirements and to chip-based protection devices can be designed to integrate with the advanced Integrated Circuits or used independent of the electrostatic protection element in the system. Based on the test results, this thesis production of low capacitance, surge suppression components can indeed consistent with low-capacitance low-voltage surge suppression characteristics of the demand components and applications. At the same time in this study, we measured by DSC thermal analysis system for testing of components than the Trigger voltage and temperature and the gap changes, The best design can clearly understand each element together with knowledge of parameter adjustment can help ESD bombardment test mechanism analysis and carry out structural components.
author2 Cheng-Liang Huang
author_facet Cheng-Liang Huang
Chih-ShunLiu
劉誌順
author Chih-ShunLiu
劉誌順
spellingShingle Chih-ShunLiu
劉誌順
Development of ultra capacitance ESD suppressor for HDMI application
author_sort Chih-ShunLiu
title Development of ultra capacitance ESD suppressor for HDMI application
title_short Development of ultra capacitance ESD suppressor for HDMI application
title_full Development of ultra capacitance ESD suppressor for HDMI application
title_fullStr Development of ultra capacitance ESD suppressor for HDMI application
title_full_unstemmed Development of ultra capacitance ESD suppressor for HDMI application
title_sort development of ultra capacitance esd suppressor for hdmi application
publishDate 2010
url http://ndltd.ncl.edu.tw/handle/20719190817762194041
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