A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials

博士 === 國立成功大學 === 建築學系碩博士班 === 98 === Electromagnetic interference (EMI) is a new form of pollution discovered in recent years. The elements Sn, Al and Cu not only possess EMI shield efficiency, but also have acceptable costs. Sn-xAl powder complex materials are used as coating in building materials...

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Main Authors: Fei-ShuoHung, 洪飛碩
Other Authors: Che-Ming Chiang
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/62544270847571943080
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spelling ndltd-TW-098NCKU52220212015-10-13T18:26:17Z http://ndltd.ncl.edu.tw/handle/62544270847571943080 A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials 錫基建築粉末在玻璃材料之電磁波遮蔽特性研究 Fei-ShuoHung 洪飛碩 博士 國立成功大學 建築學系碩博士班 98 Electromagnetic interference (EMI) is a new form of pollution discovered in recent years. The elements Sn, Al and Cu not only possess EMI shield efficiency, but also have acceptable costs. Sn-xAl powder complex materials are used as coating in building materials. This study coats complex colloid mixed with Sn-xAl powders and polyethylene on glass to examine the shield effect on electromagnetic interference (EMI). The results show that adding Al to the Sn-xAl powders can increase the electromagnetic interference (EMI) shield at lower frequencies. Notably, the number of cavities in the coating layer increased with the coating thickness, with the result that the EMI shield could not improve with an increase in the coating thickness at higher frequencies. In this study, sputtered Sn-Al thin films and Sn-Cu thin film were used to investigate the effect of the crystallization mechanism and film thickness on the electromagnetic interference (EMI) characteristics. In addition, the annealed microstructure, electrical conductivity and EMI of the Sn-xAl films and the Sn-xCu films were compared. The results show that Sn-Al film increased the electromagnetic interference (EMI) shielding after annealed. For the Sn-Cu films with higher Cu atomic concentration, the low frequency EMI shielding could not be improved. After annealing, the Sn-Cu thin film with lower Cu content possessed excellent EMI shielding at lower frequencies, but had an inverse tendency at higher frequencies. For both the Sn-Al and Sn-Cu thin films, after crystallized treatment, some sputtering films had higher electric conductivity, however the EMI shielding was not enhanced completely. Che-Ming Chiang 江哲銘 2010 學位論文 ; thesis 89 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 博士 === 國立成功大學 === 建築學系碩博士班 === 98 === Electromagnetic interference (EMI) is a new form of pollution discovered in recent years. The elements Sn, Al and Cu not only possess EMI shield efficiency, but also have acceptable costs. Sn-xAl powder complex materials are used as coating in building materials. This study coats complex colloid mixed with Sn-xAl powders and polyethylene on glass to examine the shield effect on electromagnetic interference (EMI). The results show that adding Al to the Sn-xAl powders can increase the electromagnetic interference (EMI) shield at lower frequencies. Notably, the number of cavities in the coating layer increased with the coating thickness, with the result that the EMI shield could not improve with an increase in the coating thickness at higher frequencies. In this study, sputtered Sn-Al thin films and Sn-Cu thin film were used to investigate the effect of the crystallization mechanism and film thickness on the electromagnetic interference (EMI) characteristics. In addition, the annealed microstructure, electrical conductivity and EMI of the Sn-xAl films and the Sn-xCu films were compared. The results show that Sn-Al film increased the electromagnetic interference (EMI) shielding after annealed. For the Sn-Cu films with higher Cu atomic concentration, the low frequency EMI shielding could not be improved. After annealing, the Sn-Cu thin film with lower Cu content possessed excellent EMI shielding at lower frequencies, but had an inverse tendency at higher frequencies. For both the Sn-Al and Sn-Cu thin films, after crystallized treatment, some sputtering films had higher electric conductivity, however the EMI shielding was not enhanced completely.
author2 Che-Ming Chiang
author_facet Che-Ming Chiang
Fei-ShuoHung
洪飛碩
author Fei-ShuoHung
洪飛碩
spellingShingle Fei-ShuoHung
洪飛碩
A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
author_sort Fei-ShuoHung
title A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
title_short A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
title_full A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
title_fullStr A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
title_full_unstemmed A study on Electromagnetic Interference Shielding Characteristics of Powders and Glasses for Tin based Building Materials
title_sort study on electromagnetic interference shielding characteristics of powders and glasses for tin based building materials
publishDate 2010
url http://ndltd.ncl.edu.tw/handle/62544270847571943080
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