Synthesis of nanosized lead-free solder particles by chemical reduction method

• Main Authors: Hsiu-JenPan, 潘修任
• Other Authors: Jung-Hua Chou
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/66192728251634022451

碩士 === 國立成功大學 === 工程科學系碩博士班 === 98 === Since industrial revolution, the trend of material development gradually becomes lighter, thinner, shorter and smaller. Now portable, non-toxic, recyclable properties are the keys. The trend of IC development has innovated into more connecting spots, smaller lead pitch, better performance, faster signal amd smaller form factors, as well as free-lead solder meterial. With the growing environmental concern, the latter is getting more attention. This research makes nano-sized Sn-3.5Ag-0.5Zn, lead-free solder alloy by using “Chemical Reduction Method”. Keu results are as follows. Under room temperature and atmospheric pressure, the Sn-3.5Ag-0.5Zn, lead-free solder alloy is synthesized by using SnSO4, AgNO3, Zn(NO3)2 as precursor and NaBH4 as reductant and PVP as protection agent during reaction. Through refining and processing of the Sn-3.5Ag-0.5Zn alloy first and then by cleaning, filtering and drying of the Sn-3.5Ag-0.5Zn precipitation, the alloy with sizes ranging from 10 to 30 nm can be obtained. In addition, through comparing the different reactions of Sn-3.5Ag-0.5Zn alloy by adding different quantity of NaBH4 and PVP. the significance for which NaBH4, PVP and temperature interplay is described.