| Summary: | 碩士 === 國立勤益科技大學 === 冷凍空調系 === 98 === The main objective of this paper is to discuss the thermal effect on the package by different type heatsinks under uniform and non-uniform heat sources via experimental measurements and computational fluid dynamics (CFD). The research can be divided into three parts. The first part is to establish a thermal chip measurement system, which is able to make regional heat up of the chip such that forms various non-uniform heat source distributions. The system contains software, electric power control, and temperature measurement parts. The software part contains a program written by Visual Basic to make electric power control on the zones of the thermal chip and another program written by LabVIEW to make and record the temperature values measured by the resistance temperature detectors (RTDs) of package as well as by thermal couples adhered to the heatsinks. The electric control part contains the power supply and electric circuit control board, and the regional power and distribution via the integration of the software and single chip. The temperature measurement part makes the data acquisition of RTD’s and thermal couples’ signals via the source meter and NI data acquisition system. In addition, indoor to measure the junction to case thermal resistance (jc) values of the thermal chips, a jc measurement platform is designed and fabricated in the research. The second part of the research is to discuss thermal characterization of three types of heatsinks under uniform and non-uniform heat source. The discussed three types of heatsinks include a aluminum extrusion heatsink, a heatwsin with a central copper column and circular arrangement of aluminum fins, and a heatsink with heat pipes. The research adopts the Icepak software as the CFD simulation tool, a copper block bond with a ceramic heating plate to discuss the uniform heat source, and a thermal chip with five heating regions to discuss the non-uniform heat sources. The non-uniform heat sources include the cases of three, four, and five regional heating. The third part of the research is to discuss the power cycle. The maximum temperature of the thermal chip is controlled and varied between the highest and lowest set values to investigate the thermal chip under power cycle condition. The research also includes adopting transient CFD model to simulate the thermal chip under power cycle operation and the results are also compared with experiments. The results of this research will have a quite high reference value for the thermal solutions of the high-performance multi-core chips in the future.
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